Module Engineer, C4 IR - Hybrid Onsite

Intel Corporation in Leixlip, Ireland seeks a Module Engineer to enhance wafer packaging manufacturing processes. This hands-on role involves collaboration across global teams, focusing on safety, quality, and output metrics. Experience in semiconductor environments is preferred, alongside strong analytical skills.

The position offers competitive pay ranging from €49,300 to €92,600, hybrid work arrangements, and comprehensive benefits including healthcare, pensions, and 25 days annual leave.