Postdoc: Electronic Design & Advanced Packaging (Remote)

Tyndall National Institute in Cork invites applications for a Post-Doctoral Researcher in Electronic Design and Advanced Packaging. You will join the Photonics Packaging and Systems Integration Group and contribute to EU and industry-funded projects delivering next-generation packaging solutions.

You will design, model, simulate and experimentally validate electronic devices and systems, collaborating across teams to translate concepts into demonstrators and scalable results, with opportunities